Happy Holden is the Senior PCB Technologist for Mentor Graphics’ System Design Division in Longmont, CO. He is responsible for advanced and next generation printed circuit technology consulting for Mentor Graphics’ customers and MGC engineering. He has been in printed circuits in various capacities since 1970. Prior to joining Mentor, he was the Advanced Technology Manager at Westwood Assoc. and Merix Corp. He took early retirement from Hewlett-Packard after over 28 years. Mr. Holden formerly managed Hewlett-Packard's application organizations in Taiwan, was instrumental in the creation of the NanYa Plastics PCB Division and the HP/NPC joint-venture software company and then Market Development in Hong Kong for HP. His prior assignments with H-P had been as head of PCB R&D, PCB Engineering Manager, and Process Engineer.
John Andresakis is vice president of strategic technology for Oak-Mitsui Technologies. He has over 28 years of experience in the manufacturing of printed circuit boards. Before Oak-Mitsui, he held management positions with Hadco Corporation (now part of
Sanmina-SCI Corporation), Nelco, Digital Equipment and IBM. John has received eight US (and several foreign) patents related to PCB production.
Eric Bogatin has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. Eric has written four books on signal integrity and interconnect design, as well as over 200 papers. A self-described “signal integrity evangelist,” Eric has taught over 4,000 engineers in the last 20 years.
Michael Carano is with OMG Electronic Chemicals. He has been involved in the printed wiring board industry for over 29 years. His primary focus is on metallization technologies, electroplating, solderable finishes, HDI, selective metal finishing, semiconductor packaging and imaging processes. He also looks for new ways to increase the competitiveness of the North American printed wiring board industry. Mike is also involved in strategic planning and technology roadmap formulation and implementation. Carano has published over 65 technical articles and has presented numerous other papers throughout the world. He is the holder of 29 patents covering a variety of topics including plating, metallization processes & PWB fab techniques.
Karen Carpenter is the president of CMTC Associates Inc., a marketing and technology consulting firm.  She was the former marketing manager for IBM Interconnect Products Group and the Director of Marketing for Endicott Interconnect Technologies.  During her 21 year career at IBM, she held positions in Engineering, Finance, Strategic Planning and Marketing Management spanning the areas of chip packaging, printed circuit boards and electronic assembly. She provided key input and direction for EI’s strategic market direction and launch of the new company. She received her BS in Chemistry from State University of New York and received her marketing education through IBM’s professional development programs.  Karen can be reached at 607-748-7910 or karencar@att.net.
Karl H. Dietz is Technology Manager in DuPont Electronic Technologies’ Semiconductor Packaging & Circuit Materials group at Research Triangle Park, N. C. Karl has 41 years experience in a variety of R&D, Manufacturing, and Quality Control functions and holds a Ph.D. in Organic Chemistry from the University of Frankfurt, Germany.
Mark Laing is the Product Marketing Manager for Systems Manufacturing Solutions for Mentor Graphics. He has primary responsibility for the detailed product requirements of the PCB Assembly and Test product line. He has 16 Years of experience in the PCB assembly and test industry. In August, 2006, he joined Mentor Graphics as part of the Router Solutions acquisition. He possesses an in-depth knowledge of assembly, test, and inspection, including distributed test strategy analysis. Mark has a patent on testing of integrated circuit devices that was issued in the UK as well as a patent on cross-linking netlist data that has been submitted in the US.

Christophe Vaucher has spent 20 years in the PCB industry in general, dealing with Electrical Test in particular. Dr. Vaucher dedicated his Ph.D. work to the “Electrical testing of complex Printed Circuit Boards”. His expertise in the field has been recognized through many works, patents, articles, papers, workshops, and awards covering the topic of ElectricalTest including a montly column for CircuiTree magazine.
In 2002, he founded Beamind, a  French company which introduced a Non Contact Electrical Test technology (Laser Direct Testing or LDT) dedicated to the test of HDI Substrates. As of September 2008, Vaucher, the inventor of the concept of LDT technology, which is now successfully introduced on the market, will no longer belong to the operations of Beamind. He can be contacted at chrisvaucher@orange.fr.

Per Viklund is Director of IC Packaging & RF at Mentor Graphics responsible for IC packaging RF design and embedded components product lines. He is a long time IEEE & IMAPS member with close to 30 years experience with electronic design and has spent the last 20 years with development of advanced EDA tools.
As a recognized industry expert in advanced packaging and RF design, Per Viklund has published numerous papers on IC packaging, embedded passives, RF and high-speed design. Prior to joining Mentor, Viklund was Chief Technical Manager of DDE-EDA for more than ten years.

Matt Wuensch is a Business Development Manager for Mentor Graphics Corporation Systems Manufacturing Solutions. With over 14 years of experience working in a PCB Manufacturing company and 10 years as a supplier to PCB Manufacturers, Matt has a unique perspective that enables him to effectively understand customers’ needs and how Mentor Graphics’ solutions bring them benefit.  Previously, Matt has worked with the following companies: Motorola, Inc. as a Production Manager, GenRad as a Product Line Director, Tecnomatix-Unicam as Sr. Director of Product Marketing, Router Solutions Inc. as the Vice President of Business Development.

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